The Galaxy S7 series of handsets is rumoured to be unveiled at a Samsung Unpacked event on Feb. 21, prior to the opening ceremony of the Mobile World Congress (MWC) 2016 in Barcelona. A recent report confirms that the handsets will house hybrid dual-SIM slots to accommodate expandable storage options.

An apparent Samsung employee based in South Korea has reportedly revealed key specifications to Naver, a South Korean publication. According to the report, it seems the Korean tech giant is planning to incorporate a dual-SIM hybrid port in the Samsung Galaxy S7 series of handsets. This means the ports will allow owners to use two SIM cards or a SIM card and microSD card.

This design will allow Samsung to continue with the unibody design and offer an option for expandable storage at the same time. Samsung’s recent offering, the Galaxy A9 (2016) also has a hybrid-dual SIM card slot.

The report further adds that the device will be marketed as ‘All Black’ and will start shipping from March 11.

To refresh earlier rumours, the Galaxy S7 is likely to be dustproof and water-resistant. The device is expected to be launched with lower camera specs but Samsung will reportedly ship the device with an improved aperture of f/1.7 for low-light photography, as reported by Tech Times.

The Galaxy S7 will apparently ship with two different processors for different markets. Samsung has roped in Snapdragon 820 chipset for its international markets whereas the Exynos 8890 powered variant will be released in the US and China.

Previous rumours also suggested that the Samsung Galaxy S7 series would sport a pressure-sensitive display technology similar to that of Apple’s 3D Force Touch in iPhone 6s lineup. The company seems to have collaborated with Synaptics, a developer of human interface solutions based on biometric technologies.

It is believed Samsung will also borrow another iPhone feature for its Galaxy S7 handsets. The company seems to be working on its own version of Live Photos, called Vivid Photo.

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