Huawei, the Chinese smart phone manufacturer, is reportedly ready to become the rival of Samsung Galaxy S4 with a new super-slim device. According to the Chinese web site mobile163, Huawei will launch another high-powered smart phone in April 2013.

Features and specifications of the upcoming high-powered smart phone were leaked as well on the internet. The new Huawei smart phone is still nameless but the Chinese reports claim it will have a 4.9-inch Full HD screen display, 1.8GHz quad-core ARM Cortex A15 processor paired with a Mali T604 GPU, 2GB of RAM and a 13MP rear camera powered with the 2600mAh battery.

The leaked details further noted that Huawei could incorporate all of the mentioned features and specifications into a 6.3mm thick smart phone body which makes it thinner compared to the 7.9mm thickness of the Samsung Galaxy S4.

Earlier this year, the Chinese company has already unveiled two sophisticated quad-core smart phones. The 5-inch Huawei Ascend D2 was announced at the 2013 Consumer Electronics Show (CES) while the 4.7-inch Huawei Ascend P2 arrived at the 2013 Mobile World Congress.

It appears that Huawei is prepared to further aim at the finest end of the smart phone market with a new super-slim smart phone and compete with rivals such as the Samsung Galaxy S4, Apple iPhone 5 and HTC One M7.

Huawei could have the advantage of leading the smart phone competition if their upcoming smart phone is offered with a low price. A high-powered smart phone with a very affordable price can easily attract the consumers.

However, the reports did not confirm whether the new Huawei super-slim smart phone will be released only in China or it will be available in other countries as well.

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